Thermal Evaporation

Thermal evaporation is one of the simplest of Physical Vapor Deposition (PVD) used to deposit material. The materials (metal, organic materials...) are placed in a resistive heat source in vacuum environment to evaporate directly to the substrate, where they condense back to a solid state form a thin film. Thermal evaporation offers faster evaporation rates than sputtering. However, it is limited to size of boat or crucible to contain the material and difficult to control of the evaporation rate.

Metal Thermal evaporation system is the most common method of Physical Vapor Deposition (PVD). It is one of the simplest forms of PVD. The evaporation source using electric heating can be used to deposit most organic and inorganic thin films, among which the resistance Joule method is the most common. The advantage of these evaporation sources is that they can provide a simple method of thin film deposition, and current flows through the resistance element that needs to deposit material, thereby heating the material.

When the temperature is heated so that the vapor pressure of the deposited material exceeds the temperature of the vacuum chamber, the material will begin to evaporate and deposit onto the substrate. For SYSKEY's system can control the evaporation rate, the film thickness and uniformity is less than +/- 3%.

Organic material thermal deposition system is a thermal evaporation system deposited organic materials onto substrate surface. This process requires high precision and uniformity of thin films by accurately controlling temperature and deposition rate.

To achieve the requirements, organic material thermal deposition system uses effusion cell as heating source with metal, quartz, ceramic or PBN crucible to contain organic material as well a PID controller to control deposition rate. This system is usually used in organic electronic research fields such as OPV, OLEDs, OPDs...