Magnetron Sputter

Sputtering deposition is a Physical Vapor Deposition (PVD) method of thin films deposition by sputtering material from a target, then depositing it onto a substrate. In this technique, the target source material is bombarded by Argon or Nitrogen plasma and the substrates are placed in front of the target at an appropriate distance.
The positive ions present in the plasma of a magnetically enhanced glow discharge bombard the target at a very high velocity due to the momentum of collisions. These particles cross the vacuum deposition chamber of the sputter gun and deposit on the substrate surface as thin films of target material. Depending on the target material, the power of sputter gun is adjusted appropriately such as DC for conductive targets and RF for non-conductive targets.
Today, sputtering deposition process is a core technique applied in many applications of semiconductors, LCD panels, solar panels and optical devices by uniformity of thin films and commercial efficiency in large scale more than other conventional methods melting a source material with thermal energies

Co-sputtering is simultaneous coating from two or multiple sputtering targets. It is used for compound - alloy or composite material. The thin film is controlled by optimizing the power density of each gun (target). SYSKEY's magnetron co-sputtering system provides precise control of multiple magnetron sputtering process conditions to provide customers with the best quality composite film.

An UHV Sputter environment is characterized by pressures lower than 10-8 ~10-12 Torr and it is common in chemistry, physics, and engineering. For UHV environment, it is very important to scientific research, because experiments often require surfaces to be maintained in a contamination-free state for the duration of the process and use of low energy electron and ion-based experimental techniques without undue interference from gas phase scattering. In the Ultra-High Vacuum sputter system, SYSKEY can perfectly produce high-quality thin films.

The structure of the multilayer films are widely used in various field, and the precision systems require more stringent specifications, including light, sounds, and electricity components. The high-quality multilayer films are becoming increasingly important in precision systems that single material thin film cannot practice the required specifications. Therefore, the development of new materials and the processes of accurately control of thin films have become an important direction of multilayer thin films research.

In-Line sputtering deposition system is that substrates passed linearly beneath one or more sputter cathodes to acquire their thin film coating. And it can just be chains running along rails through the vacuum chamber.

For the power can be any of the various types available, such as RF, DC, or pulsed DC asdesired for the application. Optional stages such as sputter etch, heat, or ion sources can also be accommodated, and the full array of instrumentations and controls are available formetallic/conductive coatings, dielectrics, optical coatings or other sputter applications.

With the increase in size of LCD panels and glass need of manufacturing, manufacturing equipment has also become larger, requiring ever-larger equipment investments. SYSKEY develops a system of PVD equipment for small and medium size needs. It has 4 independent sputtering chambers, allowing customers to arbitrarily match the deposited materials, while maintaining a quick and low-cost system.

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