Real-Time Coefficient of Friction
Controlled Down Force and Speed
Integrated 3D profilometer
Several wafer sizes can be mounted
In-line Temperature and Acoustic Emission to study process
Advance process and product development with our CMP R&D polisher. We optimized product development by providing several polishing processes on one platform. This includes a wide speed range, closed-loop downforce control, versatile wafer holders, and an automatic slurry delivery system. Additionally, the CMP tester monitors several in-line signals during the polishing process.
Besides polishing wafers & substrates, the tester comes with an in-line surface profilometer. This combination provides information on how the surface, friction, and to wear changed. As well as, why imperfections occur.