CP-5000 Chemical Mechanical Polisher Tester

Main Features:

Real-Time Coefficient of Friction
Controlled Down Force and Speed
Integrated 3D profilometer
Several wafer sizes can be mounted
In-line Temperature and  Acoustic Emission to study process
Advance process and product development with our CMP R&D polisher. We optimized product development by providing several polishing processes on one platform. This includes a wide speed range, closed-loop downforce control, versatile wafer holders, and an automatic slurry delivery system. Additionally, the CMP tester monitors several in-line signals during the polishing process.

Besides polishing wafers & substrates, the tester comes with an in-line surface profilometer. This combination provides information on how the surface, friction, and to wear changed. As well as, why imperfections occur.

Powered by MakeWebEasy.com
This website uses cookies for best user experience, to find out more you can go to our Privacy Policy  and  Cookies Policy