Electron Beam Evaporation
E-beam evaporation is a physical vapor deposition (PVD) technique where electron beam is generated from a tungsten filament and driven by electric and magnetic fields toward source material and transforms it into the gaseous phase to be deposited on the substrate surface. This process occurs in high vacuum environment to form a thin film on substrate surface by the free path. E-beam evaporation has more advantages than thermal evaporation. It is able to melt material at very high temperature even tungsten, graphite,...; easy to control evaporation rate with combining quartz crystal sensor for feedback signal for adjust e-beam current and evaporate more materials without breaking vacuum. Thus, electron beam evaporation is used in the field of thin film processes, including semiconductors, optics, solar panels, glasses, and architectural glass, so that they have the required conductive, reflective, transmission and electronic properties.
SYSKEY's Electron beam deposition is a practical and highly reliable system. Our system can use a single large crucible for mass production, or multiple crucibles to achieve a multilayer film structure. We support semiconductor research and large equipment design. Planetary rotation design for single and multi-substrate can control the evaporation rate, the film thickness and uniformity is less than +/- 3%.
An Ultra High-Vacuum (UHV) E-beam deposition system is characterized by pressures lower than 10-8 ~10-12 Torr and it is common in chemistry, physics, and engineering. UHV environment is very important to scientific research, because experiments often require surfaces to be maintained in a contamination-free state for the duration of the process and use of low energy electron and ion-based experimental techniques without undue interference from gas phase scattering.In the ultra-high vacuum environment E-beam system, SYSKEY can perfectly produce high-quality thin films.
Lift-Off is a process of creating pattern on the substrate surface and opposite to etching process. In this process, E-beam evaporation is used to deposit desired layer (metal) in substrate surface. For SYSKEY's system can control the evaporation rate, the film thickness and uniformity is less than +/- 3%.